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NEWS

  • 2026-01

    21.5” Android Kit integrating with multiple I/O: XMP-M001A-F215#RK3568

    • CPU:
      • Quad-core 64-bit Cortex-A55, up to 2.0GHz;
      • ARM G52 2EE; supports OpenGL ES3.1.1/2/3.2, Qucal, Vulkan 1.1;
      • Up to 1 TOPS computing power
      • Memory: 2GB / 4GB / 8GB
      • EMMC: 19GB-256GB
      • Operating System: Android 11
    • Display & Interfaces:
      • Display Output: eDP / MIPI / LVDS / VGA
      • HDMI: Up to 1080P
      • eDP: 4Lane, supports MIPI LCD panels
      • LVDS: Single/Dual-channel 30 Pin
      • VGA: Optional (mutually exclusive with HDMI)
      • TF Card: Up to 128GB
      • CTP Interface: For capacitive touch panels
    • Network & Upgrade:
      • Ethernet: Dual 10/100/1000Mbps
      • auto-switching ports
      • Wireless: Built-in Wi-Fi 6, Bluetooth 5.4, hotspot sharing
      • 4G: Optional via external USB module
    • Smart Features:
      • Infrared remote control & status LED
      • Gravity sensor (optional)
      • RTC with scheduled power on/off function
    • Industrial Grade Option
      • RK3568J CHIP Operating Temperature: -40°C ~ 85°C
    • Dimensions & Environment
      • Board Size: 17.6mm × 104mm (±0.5mm)
      • Thickness: 1.6mm (±10%)
      • Operating Temperature: 0°C ~ 80°C (recommended 5°C ~ 35°C)
      • Humidity: 10% ~ 90% (non-condensing)
      • Android Kit integrating with multiple I/O Specification Download

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